Modules / SPICE Module

SPICE Module

Device-level switching detail inside the SIMBA workflow.

The SIMBA SPICE Module lets teams move from fast system-level studies to detailed semiconductor behavior without rebuilding the circuit in a separate tool. Use ideal switches for exploration, then bring vendor SPICE models into the same simulation environment when gate-drive, parasitic, and transient effects matter.

Switching curves comparing system-level and SPICE-level behavior
Compare fast system-level models and detailed SPICE behavior in one SIMBA environment.

One model path from architecture to switching detail

Power electronics teams often maintain separate system and SPICE projects. The SPICE Module keeps the design workflow unified so engineers can increase model fidelity only where the study requires it.

Unified solver Workflow

Run system-level and SPICE-level simulations in the same SIMBA project, with the same solver and the same analysis workflow.

Vendor models SPICE

Import native SPICE netlists to study non-linear capacitances, gate resistance, switching transients, and detailed device behavior.

ZVS losses Thermal

Generate custom loss data under Zero-Voltage Switching operation for topologies such as LLC and Dual Active Bridge converters.

DSET Speed

Combine switching-scale electrical detail with longer thermal time horizons using Dual Stage Electro-Thermal Simulation.

Designed for SiC and GaN switching studies

Wide-bandgap devices make switching dynamics, parasitics, and gate-drive behavior harder to ignore.

Detailed model Detailed SPICE model diagram

Place detailed vendor models directly into the system simulation where device physics are needed.

System model System-level switch model diagram

Keep fast ideal-switch models for architecture exploration, efficiency maps, and large sweeps.

From SPICE transients to thermal decisions

The SPICE Module is useful when standard datasheet loss data is not enough, especially for high-frequency converters, ZVS operating modes, gate-driver studies, and switching-event validation.

Detailed device simulations can feed custom thermal descriptions so the same design can return to fast system-level studies with more accurate loss assumptions.

Typical studies
Gate resistance and overshoot
ZVS turn-on loss generation
SiC and GaN switching detail
Electrothermal validation
Optional module

Add detailed SPICE simulation when the design requires it

Use the SPICE Module alongside SIMBA Desktop and the Python Library to move between interactive design, automated campaigns, and device-level validation.

  • Native SPICE netlist support for detailed semiconductor models
  • System-level and device-level simulation in one environment
  • Custom loss-data workflows for ZVS and other operating modes
  • Useful for gate-drive, parasitic, EMI-oriented, and electrothermal studies